BDN13-3CB/A01

BDN13-3CB/A01



Производитель:

CTS Thermal Management Products
Описание:
 HEATSINK CPU W/ADHESIVE 1.31"SQ
Категория:
 Fans, Thermal Management
Корпус:
 --
Год:
 --

Datasheet (Техническое описание) BDN13-3CB/A01

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog InformationBDN13-3CB/A01
VendorCTS Thermal Management Products
CategoryFans, Thermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.35" (9mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow6.0°C/W @ 400 LFM
Outline33.27mm x 33.27mm
Thermal Resistance @ Natural16.1°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names BDN13 3CB A01
BDN133CBA01
294 1100 ND
2941100ND
294-1100


 
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