375324B00035G




Производитель:


Aavid Thermalloy
Описание:
HEAT SINK FOR BHA
Категория:
Thermal Management
Корпус:
--
Год:
--

Datasheet (Техническое описание) 375324B00035G

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog Information375324B00035G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.4" (10.16mm)
Material-
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise0.5W @ 40°C
Thermal Resistance @ Forced Air Flow21.2°C/W @ 200LFM
Outline10.2mm x 10.2mm
Thermal Resistance @ Natural71.4°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 375324B00035G
375324B00035G


 
Похожие микросхемы:


3754
ALUM MINIATURE BOX W/COVER CLEAR
37530
FERRULE WIRE UNINS 4AWG 100PC
3753
ALUM MINIATURE BOX W/COVER BLUE
37520
FERRULE WIRE UNINS 6AWG 100PC
3752
BOX BNC F/M W/CVR 1.5X1.13X0.88"
375124B60024G
HEATSINK BGA W/O SOLDER ANCHORS
3751
BOX BNC F/F W/CVR 1.5X1.13X0.88"
375024B60024G
HEATSINK BGA W/O SOLDER ANCHORS
375024B00035G
BGA HEAT SINK
375024B00032G
HEATSINK BGA W/ADHESIVE TAPE
375
SPACER PHENOLIC #8 2.0"L NATURAL