373324M00032

373324M00032



Производитель:


Aavid Thermalloy
Описание:
HEATSINK BGA W/ADHESIVE TAPE
Категория:
Thermal Management
Корпус:
--
Год:
--

Datasheet (Техническое описание) 373324M00032

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog Information373324M00032
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.24" (6.10mm)
Material-
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise1.5W @ 50°C
Thermal Resistance @ Forced Air Flow10.0°C/W @ 200 LFM
Outline37.40mm x 37.40mm
Thermal Resistance @ Natural-
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names 373324M00032
373324M00032
HS315 ND
HS315ND
HS315


 
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373324M00032G
HEATSINK BGA W/ADHESIVE TAPE
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37321000430
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37321000410
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37321000000
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37316300000
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37315000000
FUSE FAST-ACT 5.00A UL AMMO TR5
37314000430
FUSE FAST-ACT 4.0A UL SHORT TR5
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FUSE FAST-ACT 4.00A 250V UL TR5
37314000000
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