364424B00032

364424B00032



Производитель:

Aavid Thermalloy
Описание:
 HEATSINK BGA W/ADHESIVE TAPE
Категория:
 Thermal Management
Корпус:
 --
Год:
 --

Datasheet (Техническое описание) 364424B00032

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog Information364424B00032
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.45" (11.43mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise2W @ 40°C
Thermal Resistance @ Forced Air Flow6.0°C/W @ 200 LFM
Outline40.00mm x 40.00mm
Thermal Resistance @ Natural-
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names 364424B00032
364424B00032
HS312 ND
HS312ND
HS312


 
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