2519B-EP11-BGS5G

2519B-EP11-BGS5G



Производитель:

Aavid Thermalloy
Описание:
 HEATSINK BGA W/CLIP
Категория:
 Thermal Management
Корпус:
 --
Год:
 --

Datasheet (Техническое описание) 2519B-EP11-BGS5G

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog Information2519B-EP11-BGS5G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodClip
Height0.62" (15.75mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise1W @ 20°C
Thermal Resistance @ Forced Air Flow6.3°C/W @ 200 LFM
Outline34.50mm x 31.40mm
Thermal Resistance @ Natural19.7°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 2519B EP11 BGS5G
2519BEP11BGS5G
HS309 ND
HS309ND
HS309


 
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