APF30-30-10CB/A01

APF30-30-10CB/A01



Производитель:


CTS Thermal Management Products
Описание:
HEATSINK FORGED W/ADHESIVE TAPE
Категория:
Fans, Thermal Management
Корпус:
--
Год:
--

Datasheet (Техническое описание) APF30-30-10CB/A01

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog InformationAPF30-30-10CB/A01
VendorCTS Thermal Management Products
CategoryFans, Thermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.37" (9.40mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.3°C/W @ 200 LFM
Outline30.00mm x 30.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names APF30 30 10CB A01
APF303010CBA01
294 1154 ND
2941154ND
294-1154


 
Похожие микросхемы:


APF40-40-13CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF40-40-13CB
HEATSINK LOW-PROFILE FORGED
APF40-40-10CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF40-40-10CB
HEATSINK LOW-PROFILE FORGED
APF40-40-06CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF40-40-06CB
HEATSINK LOW-PROFILE FORGED
APF3236SURKVGAPBA
LED 3.2X3.6MM R/G/B WTR CLR SMD
APF30-30-13CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF30-30-13CB
HEATSINK LOW-PROFILE FORGED
APF30-30-10CB
HEATSINK LOW-PROFILE FORGED
APF30-30-06CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF30-30-06CB
HEATSINK LOW-PROFILE FORGED
APF19-19-13CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF19-19-13CB
HEATSINK LOW-PROFILE FORGED
APF19-19-10CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF19-19-10CB
HEATSINK LOW-PROFILE FORGED
APF19-19-06CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
APF19-19-06CB
HEATSINK LOW-PROFILE FORGED