335824B00034

335824B00034



Производитель:

Aavid Thermalloy
Описание:
 HEATSINK BGA W/ADHESIVE TAPE
Категория:
 Thermal Management
Корпус:
 --
Год:
 --

Datasheet (Техническое описание) 335824B00034

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog Information335824B00034
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.37" (9.40mm)
Material-
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise1W @ 30°C
Thermal Resistance @ Forced Air Flow8°C/W @ 250 LFM
Outline30.00mm x 30.00mm
Thermal Resistance @ Natural29.4°C/W
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names 335824B00034
335824B00034
HS311 ND
HS311ND
HS311


 
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